LL4620~LL4125
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Low current operation at 250uA
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below
Mounting Position: Any
LL4620~LL4125
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Low current operation at 250uA
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below
Mounting Position: Any
SURFACE MOUNT ZENER DIODES
FEATURES
contains :
ZMM55-B2V4
ZMM55-B2V7
ZMM55-B3V0
ZMM55-B3V3
ZMM55-B3V6
ZMM55-B3V9
ZMM55-B4V3
ZMM55-B4V7
ZMM55-B5V1
ZMM55-B5V6
ZMM55-B6V2
ZMM55-B6V8
ZMM55-B7V5
ZMM55-B8V2
ZMM55-B9V1
ZMM55-B10
ZMM55-B11
ZMM55-B12
ZMM55-B13
ZMM55-B15
ZMM55-B16
ZMM55-B18
ZMM55-B20
ZMM55-B22
ZMM55-B24
ZMM55-B27
ZMM55-B30
ZMM55-B33
ZMM55-B36
ZMM55-B39
ZMM55-B43
ZMM55-B47
ZMM55-B51
ZMM55-B56
ZMM55-B62
ZMM55-B68
ZMM55-B75
SURFACE MOUNT ZENER DIODES
FEATURES
contains :
ZMM55-B2V4
ZMM55-B2V7
ZMM55-B3V0
ZMM55-B3V3
ZMM55-B3V6
ZMM55-B3V9
ZMM55-B4V3
ZMM55-B4V7
ZMM55-B5V1
ZMM55-B5V6
ZMM55-B6V2
ZMM55-B6V8
ZMM55-B7V5
ZMM55-B8V2
ZMM55-B9V1
ZMM55-B10
ZMM55-B11
ZMM55-B12
ZMM55-B13
ZMM55-B15
ZMM55-B16
ZMM55-B18
ZMM55-B20
ZMM55-B22
ZMM55-B24
ZMM55-B27
ZMM55-B30
ZMM55-B33
ZMM55-B36
ZMM55-B39
ZMM55-B43
ZMM55-B47
ZMM55-B51
ZMM55-B56
ZMM55-B62
ZMM55-B68
ZMM55-B75
BIDIRECTIONAL DIODE THYRISTOR
FEATURES
? Low breakover current.
? Trigger diode with a fixed voltage reference.
? Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
? Packing information
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Approx. Weight: 0.03 grams
T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel
BIDIRECTIONAL DIODE THYRISTOR
FEATURES
? Low breakover current.
? Trigger diode with a fixed voltage reference.
? Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
? Packing information
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Approx. Weight: 0.03 grams
T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel
FAST SWITCHING SURFACE MOUNT DIODES
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
? Case: Mini Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only
FAST SWITCHING SURFACE MOUNT DIODES
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
? Case: Mini Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only
SURFACE MOUNT ZENER DIODES
FEATURES
MECHANICAL DATA
SURFACE MOUNT ZENER DIODES
FEATURES
MECHANICAL DATA
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below
Mounting Position: Any
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below
Mounting Position: Any
SURFACE MOUNT ZENER DIODES FEATURES
0.063(1.6) 0.055(1.4)DIA. 0.020(0.5) 0.012(0.3) 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) |
VOLTAGE
2.0 to 56 Volt
POWER
500 mWatt
? ? ? ?
? ? ? ?
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Mounting Position: Any
Polarity : Color band denotes cathode end
SURFACE MOUNT ZENER DIODES FEATURES
0.063(1.6) 0.055(1.4)DIA. 0.020(0.5) 0.012(0.3) 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) |
VOLTAGE
2.0 to 56 Volt
POWER
500 mWatt
? ? ? ?
? ? ? ?
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Mounting Position: Any
Polarity : Color band denotes cathode end
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end
SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end
FAST SWITCHING SURFACE MOUNT DIODES
POWER
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
? Case: MINI MELF
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only
FAST SWITCHING SURFACE MOUNT DIODES
POWER
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
? Case: MINI MELF
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only
FAST SWITCHING SURFACE MOUNT DIODES
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
? Case: Mini Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only
FAST SWITCHING SURFACE MOUNT DIODES
FEATURES
? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
? Case: Mini Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only