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MCL1SS355 Micro MELF

admin — Wed, 21 Aug 2024 06:37:02 +0000

SWITCHING DIODES

FEATURES

? High speed switching .
? Electrically ldentical to Standerd JEDEC
? High Conductanc
? Axial lead Package ldeally Suited for Automatic lnsertion

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

BZM55-B2V4~BZM55-B75 （Micro MELF）

admin — Wed, 23 Mar 2022 08:55:52 +0000

SURFACE MOUNT ZENER DIODES

FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EUdirective)MECHANICAL DATA
Case: Molded Glass MICRO-MELF
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 0.011 grams
Packing informationT/R - 3K per 7" plastic Reel T/R - 10K per 13" plastic Reel

BZM55-B2V4

BZM55-B2V7

BZM55-B3V0

BZM55-B3V3

BZM55-B3V6

BZM55-B3V9

BZM55-B4V3

BZM55-B4V7

BZM55-B5V1

BZM55-B5V6

BZM55-B6V2

BZM55-B6V8

BZM55-B7V5

BZM55-B8V2

BZM55-B9V1

BZM55-B10

BZM55-B11

BZM55-B12

BZM55-B13

BZM55-B15

BZM55-B16

BZM55-B18

BZM55-B20

BZM55-B22

BZM55-B24

BZM55-B27

BZM55-B30

BZM55-B33

BZM55-B36

BZM55-B39

BZM55-B43

BZM55-B47

BZM55-B51

BZM55-B56

BZM55-B62

BZM55-B68

BZM55-B75

GMZJ2.0~GMZJ56 Micro MELF

assistant — Thu, 19 May 2016 04:04:56 +0000

SURFACE MOUNT ZENER DIODES FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2002/95/EC directives
MECHANICAL DATA
Case: Molded Glass MICRO-MELF
Terminals: Solderable per MIL-STD-750, Method 2026
Mounting Position: Any
Polarity : Color band denotes cathode end

GMZ2.0~GMZ56

assistant — Thu, 19 May 2016 04:00:35 +0000

SURFACE MOUNT ZENER DIODES FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2002/95/EC directives
MECHANICAL DATA
Case: Molded Glass MICRO-MELF
Terminals: Solderable per MIL-STD-750, Method 2026
Mounting Position: Any
Polarity : Color band denotes cathode end

BZM5221B SERIES

assistant — Thu, 19 May 2016 03:45:08 +0000

SURFACE MOUNT ZENER DIODES

FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATA
Case: Molded Glass MICRO-MELF
Terminals: Solderable per MIL-STD-750, Method 2026
Polarity: See Diagram Below
Mounting Position: Any

MCL4448 MIRCO MELF

assistant — Tue, 17 May 2016 08:19:25 +0000

FAST SWITCHING SURFACE MOUNT DIODES

POWER

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in comply with EU RoHS 2002/95/EC directives.

MECHANICAL DATA

? Case: MICRO, MELF
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Color band denotes cathode end
? Marking: Cathode Band Only

MCL4150 MICRO MELF

assistant — Tue, 17 May 2016 08:16:12 +0000

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

? Case: QUADRD Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

MCL4148 MICRO MELF

assistant — Tue, 17 May 2016 08:11:27 +0000

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in compliance with EU RoHS 2011/65/EU directive

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

MCL914

assistant — Tue, 17 May 2016 08:06:01 +0000

SWITCHING DIODES

MICRO-MELF	Unit : inch (mm)
.040(1.0) .048(1.2)DIA. .043(1.1) .008(0.2) .008(0.2) .079(2.0) .071(1.8)

VOLTAGE

100 Volts

POWER

500 mWatts

FEATURES

? Fast switching Speed.
? Electrically ldentical to Standerd JEDEC
? High Conductance
? Axial lead Package ldeally Suited for Automatic lnsertion. ? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

Case: Molded Glass MICRO MELF

Terminals: Solderable per MIL-STD-750, Method 2026

Polarity: See Diagram Below

Mounting Position: Any